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Technology Transfer


Testing(7 labs)

Foshan Center has 7 well-equipped high-end labs providing services such as reliability test, optical/electrical/thermal characterization, failure analysis, material characterization, safety test, chip-level packaging and board-level SMD prototyping and simulation design. Over 15 million RMB were invested in advance equipment procurement. High precision integrating sphere, source imaging goniometer, simulation software (ANSYS & ICEPAK), thermal transient tester were a part of the lab configuration. Foshan Center Lab has been certified by CNAS (China National Accreditation Service for Conformity Assessment, Lab code: L6751). Test reports within its certified domain are widely accepted home and abroad. Please check below services directory for more information.

1. Reliability testing Lab

  • thermal test
  • thermal and humidity test
  • bias life test
  • Test standards for customized test condition:
  • GB/T2423 series
  • JESD22 series
  • JEITA-ED-4701 series

2. Optical/Electrical/Thermal characterization testing Lab

  • Optical/electrical characterization
  • Near/far-field luminous intensity distribution measurement
  • Junction temperature/ thermal resistance/IR thermal imaging
  • Temperature dependent optical/electrical characterization
  • Luminaire illuminance/distribution measurement
  • Electrical analysis

3. Failure analysis Lab 

  • Measurement of Coating Thickness by Microscopical Method
  • Optical Microscopy
  • Measurement of Coating Thickness by Microscopical Method
  • Scanning Electron Microscopy
  • Energy Dispersive X-ray Spectroscopy
  • Dye Penetration Test
  • Moisture Absorption Test
  • Sulfidation Resistance Test
  • Reverse Engineering

4. Material characterization testing Lab

  • DSC test(curing (profile characterization/Tg/melting temperature/crystallization temperature/specific heat capacity)
  • Viscosity/viselasticity measurement
  • Phosphors spectrum characterization (emission/excitation spectrum/intensity/quantum yield/color coordination/temperature characterization)
  • Bonding strength test
  • Mechanical properties characterization
  • Thermal conductivity measurement

5. Safety testing Lab

  • Endurance tests and thermal tests
  • Resistance to heat, fire and tracking
  • Provision for earthing
  • Protection against electric shock
  • Resistance to dust and moisture
  • Cap temperature rise
  • Transformer heating
  • Resistance to corrosion
  • Insulation resistance and electric strength
  • Creepage distances and clearances

6. Chip-level packaging and board-level SMD prototyping Lab

  • Die bonding: all kinds of SMD LED, COB and matrix module
  • Wire bonding: all kinds of SMD LED, COB and matrix module
  • Gluing: high/low viscosity silicone with/without phosphors packaging
  • SMT: suitable for all kinds of SMD LEDs

7. Simulation design Lab

  • Simulation design