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Technology Transfer

Guangzhou (Nansha)

Research centers 

Research framework: 4 Divisions, 16 research centers

(I)    Division of Internet of Things

  • Digital Life Research Center (DLRC)
  • Guangzhou Digital Life Engineering Technology Research Center
  • International Co-founded Research Center for mobile intelligent sensing and Computing

(II)    Division of Advanced Manufacturing and Automation

  • Center for Polymer Processing and System (CPPS)
  • National Engineering Research Center for Industrial Automation (South China)
  • Academician workstation for monitoring and fault diagnosis of batch processes
  • Guangzhou plastic processing intelligent industry engineering technology research center

(III)    Division of Advanced Engineering Materials

  • The Center for Engineering Materials and Reliability (CEMAR)
  • Co-founded Laboratory of Solid State Lighting Research
  • Center for Green Products and Processing Research Center (CGPP)

(IV)    Division of Green Building and Environmental

  • Building Energy Research Center (BERC)
  • Atmospheric Research Center (ARC)
  • Co-founded Laboratory for the study of atmospheric environment in the Pearl River Delta
  • Ocean Dynamics and Modeling Program (ODMP)
  • Co-founded Laboratory for Offshore Observation and Simulation
  • Wastewater Technology Laboratory (WTL)

Co-founded Laboratories

  1. International Co-founded Research Center for mobile intelligent sensing and Computing
  2. Big Data Laboratory
  3. Co-founded Laboratory for high performance polymer materials processing and equipment
  4. Co-founded Laboratory of Solid State Lighting Research
  5. International Co-founded Research Center of super light and high strength engineering materials
  6. Co-founded Laboratory for the study of atmospheric environment in the Pearl River Delta
  7. Co-founded Laboratory for Offshore Observation and Simulation


  • Analysis for material morphology
    • Analysis for apparent morphology
      • Surface morphology/microstructure/appearance fault
      • Nano materials particle diameter distribution
      • Surface roughness/analysis for three-dimensional surface/analysis for two-dimensional curve
    • Analysis for internal structure
      • Internal ultrastructure for samples/crystallographic texture
      • Internal three dimensions X-ray images for samples (faultless inspection)
      • Internal structure faults for samples (crack, cracking, gap and interface delamination)
      • Deblocking and destruction


  • Analysis for material property and composition
    • Analysis for mechanical property of materials
      • Material hardness/material modulus/scratch resistance/ abrasive resistance
      • Material mechanical property/ breaking tenacity/ shear strength/ tensile strength, etc.
      • Storage modulus and loss modulus
      • Material dynamic mechanical property
      • Stress relaxation and creepage
    • Analysis for thermal property of materials
      • Material heat conductivity coefficient/material heat capacity
      • Melting temperature/melting enthalpy/crystallization temperature//crystallization enthalpy/ crystallinity/ specific heat capacity
      • Glass-transition temperature
      • Heat stability
      • Phase inversion temperature
      • Secondary phase inversion temperature
      • Curing reaction
      • Low temperature property
      • Compatibility of blended polymers
      • Crosslinking speed and crosslinking degree of polymer materials
      • Coefficient of thermal expansion/material softening temperature/ material heat deflection temperature
      • Heat stability/composition analysis/ solvent and filler content
      • Viscosity/viscoelasticity/macromolecule molecular weight distribution/ polymer melt/ polymer solution, suspension liquid, emulsion, coating, printing ink and other rheological properties.
      • Chemical reaction thermodynamics and dynamics
    • Analysis for element composition
      • Element and ion detection
      • Metal element detection
      • Surface pollutant detection
      • Polymer functional group
      • Determination of organic matter
      • Element depth distribution
      • Compound formula
      • Oxide layer thickness/ multi-coated thickness distribution
      • Physical structure/crystal habit/alloy phase transformation
      • Ionic concentration determination
      • Type and content of oisture, solvent, filler, etc., mixed component composition analysis
      • Material lattice representation
    • Analysis for other properties
      • Package resin and volume resistivity of nonconducting bonding material 
      • Wettability/contact angle


  • Analysis for material reliability and failure
    • Reliability analysis
      • Temperature/humidity/bias test
      • Thermal ageing test
      • Temperature cycle test
      • Falling weight impact test
      • Mechanical strength test(stretch, compact, bend, shearing, etc.
      • Three-point bending/four-point bending/nine-point bending test
      • Warpage test during sample temperature change
      • Single solder ball stretch and shearing test/gold thread stretch test/package shearing test
      • Solder ball strength test 
      • Reflow soldering analog
    • Failure analysis
      • Staining detection(interface hierarchy/soldering point cracking, etc.
      • Sample optical parameter detection
      • Structure failure analysis
      • Computer analog of mechanical structure, stress-strain, temperature and heat distribution
      • LED volt-ampere characteristics

Remarks: AES- Auger Electron Spectrometer, DMA- Dynamic Mechanical Analysis, DSC- Differential Scanning Calorimetry, EDS-Energy Disperse Spectroscopy, FESEM- Field Emission Scanning Electron Microscope, FT-IR- Fourier Transform-Infrared Spectrometry, ICP-OES- Inductively Coupled Plasma-Optical Emission Spectrometer, Rheometer-Rheometer, SAM- Scanning Acoustic Microscope, SEM- Scanning Electron Microscope, TEM- Transmission Electron Microscope, TGA- Thermogravimetric Analyzer, TGA-IR-Hermogravimetric Analyzer-Infrared Spectrometry, TMA- Thermal Mechanical Analyzer, TOF-SIMS Time of Flight-Secondary Ion Mass Spectrometer, XPD- X-ray Diffractometer, XRF-X-ray Fluorescence and XPS- X-ray Photoelectron Spectroscopy

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